| PART |
Description |
Maker |
| 0479890112 47989-0112 |
1.00mm (.039") by 1.00mm (.039") Pitch rPGA 989 Notebook PC CPU Socket, with Mylar, Hard Tray Packaging, 989 Circuits, Lead free
1.00mm (.039) by 1.00mm (.039) Pitch rPGA 989 Notebook PC CPU Socket, with Mylar, Hard Tray Packaging, 989 Circuits, Lead free
|
Molex Electronics Ltd.
|
| 0546987003 54698-7003 |
0.80mm (.031) Pitch S.O. DIMM Socket, Right Angle, Surface Mount, 5.20mm (.205)Mounted Height, 144 Circuits, 3.3V Power Supply, Hard Tray Packaging, Height11.00mm (.433) Type, Lead-free
|
Molex Electronics Ltd.
|
| 87914-2815 0879142815 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0528304432 52830-4432 |
Modular Jack, Right Angle, 4/4, 0.76μm (30μ) Gold (Au) Plating, with Beveled MetalPins, Tray Packaging, Lead-free
Modular Jack, Right Angle, 4/4, 0.76楼矛m (30楼矛") Gold (Au) Plating, with Beveled MetalPins, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 1-2013310-5 |
Memory Sockets; SEMI-HARD TRAY DDR3 204P 9.2H STD B-L025 ( Tyco Electronics )
|
Tyco Electronics
|
| 0528306642 52830-6642 |
Modular Jack, Right Angle, 6/6 Circuits, 1.3渭m (50渭 ") Gold (Au) Selective Plating, withBeveled Metal Pins, Tray Packaging, Lead-free
Modular Jack, Right Angle, 6/6 Circuits, 1.3μm (50μ ) Gold (Au) Selective Plating, withBeveled Metal Pins, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0877580817 87758-0817 |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079") Pitch Milli-Grid垄芒 Header, Through Hole, Vertical, 8 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0877580816 87758-0816 |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Through Hole, Vertical, 8 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0879145016 87914-5016 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| PS-55JD1-012M1 PS-55JD1-015M1 PS-55JD1-005M1 PS-55 |
Hi-Rel DC-DC Standard Single Converter in a ATR package; A ATR2812S with Standard Packaging
Hi-Rel RAD-Hard, Dual, 28V Input DC-DC Converter in LS package; Hi-Rel RAD-Hard, Dual, 28V Input DC-DC Converter in LS package
Hi-Rel DC-DC Standard Triple Converter in a ATO package; A ATO2812T with Standard Packaging
Analog IC 模拟IC
|
Electronic Theatre Controls, Inc.
|
| 0674921422 67492-1422 |
1.27mm (.050") Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height5.90mm (.232"), 0.38渭m (15渭") Gold (Au) Plating, Tray Packaging, 22 Circuits, Le
1.27mm (.050) Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height5.90mm (.232), 0.38μm (15μ) Gold (Au) Plating, Tray Packaging, 22 Circuits, LeadFree
|
Molex Electronics Ltd.
|
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